Hybrid Mask
Differentiated TOTAL SOLUTION TECHNOLOGY
We provide various services based on 4 core technologies.
Overview
Ultra-precision metal mask combining conventional existing screen mask and electroforming mask
Application
- Smart phone
- Wearable
- Flexible
- Hydrogen vehicle
- Alternative energy
Specification
Feature | Excellent durability compared to the conventional screen mask (10 times or more) | |
---|---|---|
For SUS Mask, nickel plating membrane replaces emulsion membrane | ||
Excellent printability and removability, flat | ||
Straight printing without damaging prints | ||
Possible to print very thick paste on minute line width | ||
Applied Fields | Solar cell, touch screen, POP/LCD, OLED,etc. | |
MLCC, LTCC, EM, MESH filter, etc. | ||
Other electrode printing |
Electroforming Products
Metal Mask
Ni + Co Alloy Plating
SMT(Surface Mounting), Integrated circuit
COB Mask
Ni + Co Alloy Plating
Chip On Board(COB)
Flip Chip
SUS 316
Flip Chip, Wafer Ball
Wafer Mask
Ni + Co Alloy Plating
Wafer Ball(300mm)
Wafer Mask
Ni + Co Alloy Plating
Wafer Flux(300mm)
Wafer Mask
Ni + Co Alloy Plating
Wafer LED(100mm)
Metal Mask
Ni + Co Alloy Plating
Chip Package
Double Layer Mask
Ni + Co Alloy Plating
Electronics
Nickel Mesh
Ni + Co Alloy Plating
Cleantech or Food Industry
Micro Sieve
Ni + Co Alloy Plating
Solder Ball, Powder
Shadow Mask
Ni + Co Alloy Plating
Electronics
Others
Ni + Co Alloy Plating
Others