E-FORM Mask
Differentiated TOTAL SOLUTION TECHNOLOGY
We provide various services based on 4 core technologies.
Overview
- E-FORM Mask applied with photolithography process provides the best printing quality.
- The most accuracy can be achieved.
- With its high printing ability and durability, it is applied to the manufacture of electronic parts and semiconductor manufacturing that requires fine pitch
- It is a stencil that can make a perfect opening shape of straight line, sphere and round.
- It can freely control the thickness required by the customer.
- It can realize the opening accuracy of ± 3㎛ and tehe opening Ra value of less than 0.1㎛.
- COB mask can be applied and partial half etching can be applied.
Application
- Smart phone
- Wearable
- Flexible
- Hydrogen vehicle
- Alternative energy
Specification
| Material | Ni + Co Alloy(HV450 or more)) | |
|---|---|---|
| Processing Thickness | 20㎛, 25㎛, 35㎛, 50㎛, 60㎛, 80㎛, 100㎛ | |
| Thickness Precision | ± 10% | |
| Processing Precision | ± 3㎛ | |
| Minimum Opening | minimum 20㎛ | |
| Applied Products | Wafer Bumping, Electrode Printing, Next-generation Metal Masks | |
| Delivery | within 6 ~ 7 days | |
| Frame Size | 650mm × 550mm or 736mm × 736mm | |
| Draining of Paste | Excellent | |
| Feature | Photo-mask is manufactured after designing Auto CAD | |
| Patterning by applying photolithography process | ||
| Manufacture plating layer for selected patterns with Ni + Co | ||
| Thickness of plating can be freely changed | ||
| Unlike laser cutting method, no burr in the opening | ||
| Laser, the most precise pattern and accuracy compared to etching | ||
| All kinds of patterns and structures can be made | ||
| Alternative technology | Laser Mask, Etching Mask | |
| Applied Fields | Semi-conductor, LED, Electric Parts |
Metal Mask Products
G6080 LPKF Laser SUS 304H-TA CAM Data laser direct processing
G6080 LPKF Laser Ni + Co E-FORM Plate manufacturing Direct laser processing on plate
Photolithography application to ferric chloride SUS 304H-TA material
Photolithography application after Laser Cut + Half Etching SUS 304H-TA
Photolithography application after Laser Cut + Half Etching SUS 304H-TA
Nano Coating after G6080 LPKF Laser US 304H-TA electrolytic polishing
